Hardware Engineering Intern, 2025

Google Taipei, Taiwan

Company

Google

Location

Taipei, Taiwan

Type

Full Time

Job Description

Minimum qualifications:

  • Currently pursuing a Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science or a related field.
  • Experience in one or more of the areas: Computer Architecture, Circuit Design/Simulation, Design Verification, Digital Design, Embedded Systems, Hardware/Software, Signal and Power Integrity, EMC, Statistics, System Modeling, Networking/Security, Test/Measurement or Verilog.
Preferred qualifications:
  • Currently pursuing a Master's or PhD in Electrical Engineering, Computer Engineering, Computer Science or a related field, and returning to a degree program after the internship ends.
  • Experience (e.g., research assistant, teaching assistant, personal projects outside the classroom, etc.) in Hardware, Electrical Engineering, Mechanical Engineering, Communication Engineering, Ocean Engineering, Optical Engineering, or other related fields.
  • Knowledge and experience in Test/Design/Manufacturing/Prototyping tools.
  • Excellent coding skills with the ability to use one coding language (e.g., Python, Matlab, C++).

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About the job

As a Hardware Engineering Intern, you will design and build the systems for computing infrastructure. Your work has the potential to shape the machinery that goes into data centers affecting Google users. The teams you will work with design, develop, and deploy next-generation consumer hardware while ensuring that this equipment is reliable. You'll work closely with engineers to improve our hardware to meet Google's standards of quality and reliability. Your work will have the potential to impact many of Google users.

Depending on your experience, you may have an opportunity to work on a project in Electrical Hardware Engineering, System Hardware Engineering, Power Testing or Networking Engineering.

Responsibilities

  • Perform specific responsibilities which may vary by project area.

Apply Now

Date Posted

12/19/2024

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