Senior Principal Mechanical Engineer - Electronic Packaging - Hybrid

Date Posted:
2021-12-22-08:00
Country:
United States of America
Location:
CA320: El Seg.-So. Campus Bldg E01 2000 East El Segundo Boulevard Building E01, El Segundo, CA, 90245 USA
The Hardware Engineering Center (HWEC) is an engineering organization that focuses on Mechanical product design, producibility, and mission assurance. It is a vital link in the integrated product development process that allows Raytheon Intelligence & Space to introduce reliable new products faster, better, and more economically.

Primary job responsibilities is to perform conceptual and detailed mechanical design of High density Electronic packaging designs and Electronic components / devices for application in space applications and airborne defense.

Responsibilities include the design of electronic packaging chassis and structures, interconnects, thermal control design of high density electronic systems and electronic enclosures, adhere to design constraints of Size, Weight and Power, design to cost. Candidate will be expected to follow established procedures in creation of technical data package, design guidelines and while working closely with program / functional supervision to ensure the overall design
objectives are met. Contacts are primarily with the immediate section manager, team lead, project leaders and other personnel (peers) within the applicable program.

Relocation assistance available provided final candidate meets eligibility requirements.

Employee Referral Award Eligibility: Only employees currently within RMD and RI&S have the potential to receive a Referral Award for submitting a referral to RMD and RI&S roles. ALL eligibility requirements must be met to receive the Referral Awarding.

Required Skills:
• Minimum of 10 years of experience in mechanical engineering design and product support; with leadership role desired
• Ability to apply high level principles, theories, and concepts within the mechanical engineering field and good knowledge of other related disciplines
• Direct experience in developing detail mechanical designs and documentation packages for RF, Electronic and/or mechanical systems
• Experience with RF and electromechanical program manufacturing operations and processes
• Experience in design assembly and integration of mechanical, RF electronic systems
• Proficiency in Geometric Dimensioning and Tolerance analysis for drawings
• Proficiency with PTC CREO (Pro/Engineer) modeling and analysis tools
• Experience with M/S Office Tools i.e. Word, Excel, PowerPoint, and Visio
• Experience in developing conceptual designs in support of new business initiatives
• U.S. Citizenship is required as the candidate must have the ability to obtain DoD Secret clearance within one year of the start date.

Desired Skills:
• Additional CAD and analysis software experience
• Working knowledge of Thermal and Structural analysis tools
• Working knowledge of Environmental testing equipment, procedures and qualification activities

Required Education:
Bachelor of Science in Mechanical Engineering, or related engineering field, from an accredited university.

Desired Education:
Master of Science or Ph.D. in Mechanical Engineering, or related engineering field, from an accredited university.

Position may offer a sign-on bonus up to $20K.

This position requires either a U.S. Person or a Non-U.S. Person who is eligible to obtain any required Export Authorization.

Raytheon Technologies is An Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age or any other federally protected class.

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