数字后端设计工程师

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Description and Requirements

岗位职责：

1，ASIC IC芯片后端设计从RTL到GDSII；

2，具备完整的芯片Tapeout经验，后端布局规划（模块级或全芯片级）；

3，熟悉STA静态时序分析及低功耗设计与分析；

4，物理验证能力LVS/DRC/ERC/LVL/RTO/ANT/LUP；

5，布局布线，电源网络设计，时序收敛，功耗分析，物理验证等，掌握其中一或多个技能。

任职要求：

1. 电子工程本科及以上学历，1-3年物理设计实现相关工作经验；

2. 熟练使用主流数字后端设计平台工具，具有TCL/Perl等脚本编程经验；

3. 具备以下单项或多项经验：从RTL到GDS的芯片、复杂模块级设计实现，芯片级测试，ASIC设计和仿真，ASIC物理版图，集成电路制造和工艺；

4. 能够帮助和带领初级工程师解决问题；

Additional Locations:
* China